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以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。，这一点在同城约会中也有详细论述
Schaeffler is hoping to use robots in its own factories – for example, to load freshly made parts from conveyor belts into washing machines, prior to packaging them for shipment. "We are already experiencing a labour shortage," says Kehr. I ask whether humans who currently are doing this task will be retrained for other roles in the factory and Kehr says, "Absolutely."，推荐阅读WPS官方版本下载获取更多信息
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Of course, the size increases with each attached module. However, snapping on the power bank module makes the thickness comparable to a standard modern smartphone. Another key feature here is how these various modular components stick together. Tecno has developed new interconnection technology that uses both magnets and pin connectors. This should make it easy to both attach and remove components.